HDBSP 2.420% 24Jul2023 Qsov (SGD)

Bond Factsheet

Matured/ Called

Housing & Development Board (HDB)

Indicative

Full Lot

Bid Price

99.988

Change in Bid Price

Bid Yield (%)

Change in Bid Yield

Ask Price

99.990

Change in Ask Price

Ask Yield (%)

Change in Ask Yield

Indicative price as of 27 Jul 2023, 12:00am

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Bond Information

Housing & Development Board (HDB) constructs, upgrades, redevelops, and sells real estate properties. The Company develops and manages ancillary facilities such as commercial and industrial properties, car parks, markets, hawker centers, residential flats, and old estate.

Bond Issuer

Housing & Development Board (HDB)

Guarantor

Announcement Date

17 Jul 2018

Issue Date

24 Jul 2018

Maturity Date

24 Jul 2023

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

2.420

Coupon Type

Fixed

Annual Coupon Rate

2.420

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SGXF76695984

CUSIP

AT6332296

Bond Currency

SGD

Total Issue Size

700,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Quasi-Sovereign

Bond Sector

Financials

Bond Sub Sector

Real Estate Management and Development

Issuer Credit Rating (S&P/ Fitch)

***/ AAA

Bond Credit Rating (S&P/ Fitch)

***/ AAA

Shariah Compliant

Exchange Listed

SGX

Bond Feature(s)

Not Available

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