MAPLSP 3.400% 03Sep2026 Corp (SGD)

Bond Factsheet

Matured/ Called

Mapletree Treasury Services Limited

Indicative

Full Lot

Bid Price

100.000

Change in Bid Price

Bid Yield (%)

Change in Bid Yield

Ask Price

100.040

Change in Ask Price

Ask Yield (%)

Change in Ask Yield

Indicative price as of 03 Sep 2026, 12:00am

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Bond Information

Mapletree Treasury Services Limited operates as a special purpose entity. The Company was formed for the purpose of issuing debt securities to repay existing credit facilities, refinance indebtedness, and for acquisition purposes.

Bond Issuer

Mapletree Treasury Services Limited

Guarantor

Mapletree Investments Pte Ltd

Announcement Date

23 Aug 2018

Issue Date

03 Sep 2018

Maturity Date

03 Sep 2026

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.400

Coupon Type

Fixed

Annual Coupon Rate

3.400

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SGXF84412117

CUSIP

AU2167974

Bond Currency

SGD

Total Issue Size

300,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Financials

Bond Sub Sector

Diversified Financial Services

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

SGX

Bond Feature(s)

Not Available

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