Bond Factsheet
Bond Factsheet

SCISP 2.450% 09Jun2031 Corp (SGD)

Sembcorp Financial Services Pte. Ltd.

Indicative

Full Lot

Bid Price
98.067
Change in Bid Price
0.036
Bid Yield (%)
2.895 %
Change in Bid Yield
remove 0.008
Ask Price
98.713
Change in Ask Price
remove 0.064
Ask Yield (%)
2.745 %
Change in Ask Yield
0.015

Indicative price as of 06 Oct 2026, 4:04pm

Created with Highcharts 10.3.3Yield (%)Chart context menuYield6 Sep8 Sep10 Sep12 Sep14 Sep16 Sep18 Sep20 Sep22 Sep24 Sep26 Sep28 Sep30 Sep2 Oct4 Oct2.52.62.72.82.93

Ask Yield to Maturity

Bid Yield to Maturity


Bond InformationSembcorp Financial Services Pte. Ltd. operates as an energy transition company. The Company specializes in developing renewable energy such as solar, wind, and energy storage systems through decarbonization, water, and waste resource management for clean energy infrastructure solutions. Sembcorp Financial Services serves customers worldwide.

Bond Issuer

Sembcorp Financial Services Pte. Ltd.

Guarantor

Sembcorp Industries Ltd

Announcement Date

02 Jun 2021

Issue Date

09 Jun 2021

Maturity Date

09 Jun 2031

Years to Maturity / Next Call

4.674 / -

Modified Duration

4.343 @ 06 Oct 2026

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

2.450

Coupon Type

Fixed

Annual Coupon Rate

2.450

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

-

ISIN

SGXF23837739

CUSIP

BP9070692

Bond Currency

SGD

Total Issue Size

400,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Financials

Bond Sub Sector

Diversified Financial Services

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

No

Exchange Listed

SGX

Bond Feature(s)
Not Available
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