Hong Kong Government Infra Bond Programme
Indicative
Full Lot
Indicative price as of 30 Sep 2026, 4:04pm
Ask Yield to Maturity
Bid Yield to Maturity
Bond Issuer
Hong Kong Government Infra Bond Programme
Guarantor
-
Announcement Date
04 Dec 2024
Issue Date
05 Dec 2024
Maturity Date
05 Dec 2029
Years to Maturity / Next Call
3.179 / -
Modified Duration
2.956 @ 30 Sep 2026
Issue / Reoffer Price
100.350
Issue / Reoffer Yield
3.179
Coupon Type
Fixed
Annual Coupon Rate
3.230
Coupon Frequency
Semi Annually
Seniority
Unsecured
Reference Rate
-
ISIN
HK0001088944
CUSIP
YU8446269
Bond Currency
HKD
Total Issue Size
6,000,000,000
Min. Investment Quantity (Nominal)
HKD 50,000
Incremental Quantity (Nominal)
HKD 50,000
Bond Type
Sovereign
Bond Sector
Sovereign
Bond Sub Sector
Sovereign
Issuer Credit Rating (S&P/ Fitch)
***/ AA-
Bond Credit Rating (S&P/ Fitch)
***/ N.R
Shariah Compliant
No
Exchange Listed
HKEX
Cash Flow Information