Hong Kong Government Infra Bond Programme
Indicative
Full Lot
Indicative price as of 02 Oct 2026, 4:33pm
Ask Yield to Maturity
Bid Yield to Maturity
Bond Issuer
Hong Kong Government Infra Bond Programme
Guarantor
-
Announcement Date
15 Jan 2025
Issue Date
16 Jan 2025
Maturity Date
16 Jan 2035
Years to Maturity / Next Call
8.293 / -
Modified Duration
6.977 @ 02 Oct 2026
Issue / Reoffer Price
98.660
Issue / Reoffer Yield
4.044
Coupon Type
Fixed
Annual Coupon Rate
3.840
Coupon Frequency
Semi Annually
Seniority
Unsecured
Reference Rate
-
ISIN
HK0001101879
CUSIP
YU8446210
Bond Currency
HKD
Total Issue Size
2,000,000,000
Min. Investment Quantity (Nominal)
HKD 50,000
Incremental Quantity (Nominal)
HKD 50,000
Bond Type
Sovereign
Bond Sector
Sovereign
Bond Sub Sector
Sovereign
Issuer Credit Rating (S&P/ Fitch)
***/ AA-
Bond Credit Rating (S&P/ Fitch)
***/ N.R
Shariah Compliant
No
Exchange Listed
HKEX
Cash Flow Information