Hong Kong Government Infra Bond Programme
Indicative
Full Lot
Indicative price as of 30 Sep 2026, 4:04pm
Ask Yield to Maturity
Bid Yield to Maturity
Bond Issuer
Hong Kong Government Infra Bond Programme
Guarantor
-
Announcement Date
23 Jul 2025
Issue Date
24 Jul 2025
Maturity Date
24 Jul 2035
Years to Maturity / Next Call
8.815 / -
Modified Duration
7.525 @ 30 Sep 2026
Issue / Reoffer Price
100.430
Issue / Reoffer Yield
3.144
Coupon Type
Fixed
Annual Coupon Rate
3.170
Coupon Frequency
Semi Annually
Seniority
Unsecured
Reference Rate
-
ISIN
HK0001167730
CUSIP
YP9816420
Bond Currency
HKD
Total Issue Size
6,250,000,000
Min. Investment Quantity (Nominal)
HKD 50,000
Incremental Quantity (Nominal)
HKD 50,000
Bond Type
Sovereign
Bond Sector
Sovereign
Bond Sub Sector
Sovereign
Issuer Credit Rating (S&P/ Fitch)
***/ AA-
Bond Credit Rating (S&P/ Fitch)
***/ N.R
Shariah Compliant
No
Exchange Listed
HKEX
Cash Flow Information