Hong Kong Government Retail Infrastructure Bond Programme
Indicative
Full Lot
Indicative price as of 29 Sep 2025, 12:00am
Ask Yield to Maturity
Bid Yield to Maturity
Bond Issuer
Hong Kong Government Retail Infrastructure Bond Programme
Guarantor
-
Announcement Date
29 Sep 2025
Issue Date
10 Oct 2025
Maturity Date
10 Oct 2028
Years to Maturity / Next Call
2.026 / -
Modified Duration
-
Issue / Reoffer Price
100.000
Issue / Reoffer Yield
3.850
Coupon Type
Floating
Annual Coupon Rate
3.850
Coupon Frequency
Semi Annually
Seniority
Unsecured
Reference Rate
-
ISIN
HK0001193272
CUSIP
YK8901497
Bond Currency
HKD
Total Issue Size
55,000,000,000
Min. Investment Quantity (Nominal)
HKD 10,000
Incremental Quantity (Nominal)
HKD 10,000
Bond Type
Sovereign
Bond Sector
Sovereign
Bond Sub Sector
Sovereign
Issuer Credit Rating (S&P/ Fitch)
***/ AA-
Bond Credit Rating (S&P/ Fitch)
***/ N.R
Shariah Compliant
No
Exchange Listed
HKEX
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