Hong Kong Government Infra Bond Programme
Indicative
Full Lot
Indicative price as of 30 Sep 2026, 4:04pm
Ask Yield to Maturity
Bid Yield to Maturity
Bond Issuer
Hong Kong Government Infra Bond Programme
Guarantor
-
Announcement Date
04 Feb 2026
Issue Date
05 Feb 2026
Maturity Date
07 Feb 2033
Years to Maturity / Next Call
6.357 / -
Modified Duration
5.693 @ 30 Sep 2026
Issue / Reoffer Price
100.420
Issue / Reoffer Yield
2.864
Coupon Type
Fixed
Annual Coupon Rate
2.910
Coupon Frequency
Semi Annually
Seniority
Unsecured
Reference Rate
-
ISIN
HK0001256640
CUSIP
YJ3635440
Bond Currency
HKD
Total Issue Size
4,250,000,000
Min. Investment Quantity (Nominal)
HKD 50,000
Incremental Quantity (Nominal)
HKD 50,000
Bond Type
Sovereign
Bond Sector
Sovereign
Bond Sub Sector
Sovereign
Issuer Credit Rating (S&P/ Fitch)
***/ AA-
Bond Credit Rating (S&P/ Fitch)
***/ N.R
Shariah Compliant
No
Exchange Listed
HKEX
Cash Flow Information