STHSP 3.550% 08Jun2026 Corp (SGD)

Bond Factsheet

Matured/ Called

StarHub Ltd

Indicative

Full Lot

Bid Price

100.056

Change in Bid Price

0.006

Bid Yield (%)

Change in Bid Yield

Ask Price

100.159

Change in Ask Price

0.013

Ask Yield (%)

Change in Ask Yield

Indicative price as of 08 Jun 2026, 12:00am

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Bond Information

StarHub Ltd. is a fully-integrated info-communication company offering a full range of information, communications, and entertainment services for both consumer and corporate markets in Singapore. The Company provides mobile network and multi-channel cable TV services, including high definition and on-demand services, as well as high-speed residential broadband services.

Bond Issuer

StarHub Ltd

Guarantor

Announcement Date

31 May 2016

Issue Date

08 Jun 2016

Maturity Date

08 Jun 2026

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.550

Coupon Type

Fixed

Annual Coupon Rate

3.550

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SG73C2000007

CUSIP

LW2836887

Bond Currency

SGD

Total Issue Size

300,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Telecommunication Services

Bond Sub Sector

Wireless Telecommunication Services

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

SGX

Bond Feature(s)

Not Available

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