SCISP 3.640% 27May2024 Corp (SGD)

Bond Factsheet

Matured/ Called

Sembcorp Financial Services Pte. Ltd.

Indicative

Full Lot

Bid Price

99.996

Change in Bid Price

0.001

Bid Yield (%)

Change in Bid Yield

Ask Price

100.039

Change in Ask Price

remove 0.026

Ask Yield (%)

Change in Ask Yield

Indicative price as of 27 May 2024, 12:00am

chevron_leftchevron_right

Bond Information

Sembcorp Financial Services Pte. Ltd. operates as an energy transition company. The Company specializes in developing renewable energy such as solar, wind, and energy storage systems through decarbonization, water, and waste resource management for clean energy infrastructure solutions. Sembcorp Financial Services serves customers worldwide.

Bond Issuer

Sembcorp Financial Services Pte. Ltd.

Guarantor

Sembcorp Industries Ltd

Announcement Date

18 Nov 2013

Issue Date

27 Nov 2013

Maturity Date

27 May 2024

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.640

Coupon Type

Fixed

Annual Coupon Rate

3.640

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SG59A8998876

CUSIP

EJ9442371

Bond Currency

SGD

Total Issue Size

200,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Financials

Bond Sub Sector

Diversified Financial Services

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

SGX

Bond Feature(s)

Not Available

Bondsupermart strives to ensure the accuracy and relevance of the information provided here. If the information is not up-to-date or erroneous, we appreciate feedback to keep it accurate.