WINGTA 4.700% 28Feb2024 Corp (SGD)

Bond Factsheet

Matured/ Called

Wing Tai Holdings Limited

Indicative

Full Lot

Bid Price

100.032

Change in Bid Price

0.003

Bid Yield (%)

Change in Bid Yield

Ask Price

100.142

Change in Ask Price

Ask Yield (%)

Change in Ask Yield

Indicative price as of 28 Feb 2024, 12:00am

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Bond Information

Wing Tai Holdings Limited operates as a holding company. The Company, through its subsidiaries, provides property investment and development, lifestyle retail, and hospitality management solutions. Wing Tai Holdings serves customers in Asia.

Bond Issuer

Wing Tai Holdings Limited

Guarantor

Announcement Date

19 Feb 2014

Issue Date

28 Feb 2014

Maturity Date

28 Feb 2024

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

4.700

Coupon Type

Fixed

Annual Coupon Rate

4.700

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SG6OI9000000

CUSIP

EK0840414

Bond Currency

SGD

Total Issue Size

100,000,000

Outstanding Issue Size

80,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Financials

Bond Sub Sector

Real Estate Management and Development

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

SGX

Bond Feature(s)

Not Available

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