STSP 2.720% 03Sep2021 Corp (SGD)

Bond Factsheet

Matured/ Called

SingTel Group Treasury Pte Ltd

Indicative

Full Lot

Bid Price

100.000

Change in Bid Price

remove 0.042

Bid Yield (%)

Change in Bid Yield

Ask Price

100.100

Change in Ask Price

remove 0.059

Ask Yield (%)

Change in Ask Yield

Indicative price as of 12 Oct 2021, 12:00am

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Bond Information

Singtel Group Treasury Pte. Ltd. provides telecommunication services.

Bond Issuer

SingTel Group Treasury Pte Ltd

Guarantor

Singapore Telecommunications Ltd

Announcement Date

24 Feb 2015

Issue Date

03 Mar 2015

Maturity Date

03 Sep 2021

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

2.720

Coupon Type

Fixed

Annual Coupon Rate

2.720

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SG6VH1000005

CUSIP

EK7714901

Bond Currency

SGD

Total Issue Size

Outstanding Issue Size

150,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Telecommunication Services

Bond Sub Sector

Wireless Telecommunication Services

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

Bond Feature(s)

Not Available

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