WINGTA 4.250% 15Mar2023 Corp (SGD)

Bond Factsheet

Matured/ Called

Wing Tai Holdings Limited

Indicative

Full Lot

Bid Price

99.900

Change in Bid Price

Bid Yield (%)

Change in Bid Yield

Ask Price

100.050

Change in Ask Price

Ask Yield (%)

Change in Ask Yield

Indicative price as of 30 Mar 2023, 12:00am

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Bond Information

Wing Tai Holdings Limited operates as a holding company. The Company, through its subsidiaries, provides property investment and development, lifestyle retail, and hospitality management solutions. Wing Tai Holdings serves customers in Asia.

Bond Issuer

Wing Tai Holdings Limited

Guarantor

Announcement Date

06 Mar 2013

Issue Date

15 Mar 2013

Maturity Date

15 Mar 2023

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

4.250

Coupon Type

Fixed

Annual Coupon Rate

4.250

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SG6Z68990563

CUSIP

EJ5823244

Bond Currency

SGD

Total Issue Size

100,000,000

Outstanding Issue Size

81,500,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Financials

Bond Sub Sector

Real Estate Management and Development

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

SGX

Bond Feature(s)

Not Available

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