SIASP 3.130% 17Nov2026 Corp (SGD)

Bond Factsheet

Singapore Airlines Limited

Indicative

Full Lot

Bid Price

100.110

Change in Bid Price

remove 0.007

Bid Yield (%)

2.138 %

Change in Bid Yield

0.037

Ask Price

100.199

Change in Ask Price

remove 0.008

Ask Yield (%)

1.367 %

Change in Ask Yield

0.027

Indicative price as of 02 Oct 2026, 4:33pm

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Bond Information

Singapore Airlines Limited provides air transportation, engineering, pilot training, air charter, and tour wholesaling services. The Company's airline operation covers Asia, Europe, the Americas, South West Pacific, and Africa.

Bond Issuer

Singapore Airlines Limited

Guarantor

Announcement Date

08 Nov 2016

Issue Date

17 Nov 2016

Maturity Date

17 Nov 2026

Years to Maturity / Next Call

0.117 / -

Modified Duration

0.110 @ 02 Oct 2026

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.130

Coupon Type

Fixed

Annual Coupon Rate

3.130

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SG76F4000001

CUSIP

AL1465866

Bond Currency

SGD

Total Issue Size

630,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Industrials

Bond Sub Sector

Airlines

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

Bond Feature(s)

Not Available

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Coupon Dates	Coupon Receive	Principal Amount	Cash Flow

No Data