Bond Factsheet
Bond Factsheet
MAPLSP 3.688% 24Jun2036 Corp (SGD)

Mapletree Treasury Services Limited

Indicative

Full Lot

Bid Price
103.825
Change in Bid Price
0.083
Bid Yield (%)
3.226 %
Change in Bid Yield
remove 0.010
Ask Price
104.808
Change in Ask Price
0.083
Ask Yield (%)
3.110 %
Change in Ask Yield
remove 0.010

Indicative price as of 02 Oct 2026, 4:33pm

Created with Highcharts 10.3.3Yield (%)Chart context menuYield1 Sep3 Sep5 Sep7 Sep9 Sep11 Sep13 Sep15 Sep17 Sep19 Sep21 Sep23 Sep25 Sep27 Sep29 Sep1 Oct2.82.933.13.23.3

Ask Yield to Maturity

Bid Yield to Maturity

Bond InformationMapletree Treasury Services Limited operates as a special purpose entity. The Company was formed for the purpose of issuing debt securities to repay existing credit facilities, refinance indebtedness, and for acquisition purposes.

Bond Issuer

Mapletree Treasury Services Limited

Guarantor

Mapletree Investments Pte Ltd

Announcement Date

13 Jun 2024

Issue Date

24 Jun 2024

Maturity Date

24 Jun 2036

Years to Maturity / Next Call

9.725 / -

Modified Duration

8.087 @ 02 Oct 2026

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.688

Coupon Type

Fixed

Annual Coupon Rate

3.688

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

-

ISIN

SGXF70920990

CUSIP

YX7273403

Bond Currency

SGD

Total Issue Size

200,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Financials

Bond Sub Sector

Diversified Financial Services

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

No

Exchange Listed

SGX

Bond Feature(s)
Not Available
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Related Documents info
picture_as_pdf
Offering Circular
US$5,000,000,000 Euro Medium Term Note Programme. Offering Circular dated 29 September 2023.
Download
picture_as_pdf
Pricing Supplement
Issue of S$200,000,000 3.688 per cent. Notes due 2036. Pricing Supplement dated 19 June 2024.
Download
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