Tencent Holdings Limited
Indicative
Full Lot
Indicative price as of 01 Oct 2026, 3:50pm
Ask Yield to Worst
Bid Yield to Worst
Ask Yield to Maturity
Bid Yield to Maturity
Bond Issuer
Tencent Holdings Limited
Guarantor
-
Announcement Date
11 Jan 2018
Issue Date
19 Jan 2018
Maturity Date
19 Jan 2028
Years to Maturity / Next Call
1.299 / 1.047
Modified Duration
1.231 @ 01 Oct 2026
Issue / Reoffer Price
99.975
Issue / Reoffer Yield
3.598
Coupon Type
Fixed
Annual Coupon Rate
3.595
Coupon Frequency
Semi Annually
Seniority
Senior Unsecured
Reference Rate
-
ISIN
US88032XAG97
CUSIP
88032XAG9
Bond Currency
USD
Total Issue Size
2,500,000,000
Min. Investment Quantity (Nominal)
USD 200,000
Incremental Quantity (Nominal)
USD 1,000
Bond Type
Corporate
Bond Sector
Information Technology
Bond Sub Sector
Software
Issuer Credit Rating (S&P/ Fitch)
***/ A
Bond Credit Rating (S&P/ Fitch)
***/ A
Shariah Compliant
No
Exchange Listed
HKEX
Cash Flow Information