Bond Factsheet
Bond Factsheet

TENCNT 3.595% 19Jan2028 Corp (USD)

Tencent Holdings Limited

Indicative

Full Lot

Bid Price
98.050
Change in Bid Price
remove 0.064
Bid Yield (%)
5.174 %
Change in Bid Yield
0.062
Ask Price
98.135
Change in Ask Price
remove 0.056
Ask Yield (%)
5.104 %
Change in Ask Yield
0.055

Indicative price as of 01 Oct 2026, 3:50pm

Created with Highcharts 10.3.3Yield (%)Chart context menuYield1 Sep3 Sep5 Sep7 Sep9 Sep11 Sep13 Sep15 Sep17 Sep19 Sep21 Sep23 Sep25 Sep27 Sep29 Sep4.44.64.855.25.4

Ask Yield to Worst

Bid Yield to Worst

Ask Yield to Maturity

Bid Yield to Maturity

Bond Feature(s)
Bond InformationTencent Holdings Limited is a holding company. The Company provides services including social network, music, gateway websites, e-commerce, mobile gaming, payment system, entertainment, artificial intelligence and technology solutions through its subsidiaries. Tencent Holdings serves customers worldwide.

Bond Issuer

Tencent Holdings Limited

Guarantor

-

Announcement Date

11 Jan 2018

Issue Date

19 Jan 2018

Maturity Date

19 Jan 2028

Years to Maturity / Next Call

1.299 / 1.047

Modified Duration

1.231 @ 01 Oct 2026

Issue / Reoffer Price

99.975

Issue / Reoffer Yield

3.598

Coupon Type

Fixed

Annual Coupon Rate

3.595

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

-

ISIN

US88032XAG97

CUSIP

88032XAG9

Bond Currency

USD

Total Issue Size

2,500,000,000

Min. Investment Quantity (Nominal)

USD 200,000

Incremental Quantity (Nominal)

USD 1,000

Bond Type

Corporate

Bond Sector

Information Technology

Bond Sub Sector

Software

Issuer Credit Rating (S&P/ Fitch)

***/ A

Bond Credit Rating (S&P/ Fitch)

***/ A

Shariah Compliant

No

Exchange Listed

HKEX

Bond Feature(s)
Issuer Call
Callable 3 months prior to maturity (19 Oct 2027) at 100.
Make Whole Call
Make Whole Call @15.000000 until 19 Oct 2027
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Maturity Date: 19 Jan 2028

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