Bond Factsheet
Bond Factsheet

XIAOMI 2.875% 14Jul2031 Corp (USD)

Xiaomi Best Time International Limited

Indicative

Full Lot

Bid Price
88.349
Change in Bid Price
remove 0.073
Bid Yield (%)
5.700 %
Change in Bid Yield
0.021
Ask Price
88.569
Change in Ask Price
remove 0.069
Ask Yield (%)
5.642 %
Change in Ask Yield
0.019

Indicative price as of 06 Oct 2026, 4:04pm

Created with Highcharts 10.3.3Yield (%)Chart context menuYield6 Sep8 Sep10 Sep12 Sep14 Sep16 Sep18 Sep20 Sep22 Sep24 Sep26 Sep28 Sep30 Sep2 Oct4 Oct55.25.45.65.86

Ask Yield to Worst

Bid Yield to Worst

Ask Yield to Maturity

Bid Yield to Maturity

Bond Feature(s)
Bond InformationXiaomi Best Time International Limited operates as a special purpose entity. The Company was formed for the purpose of issuing debt securities to repay existing credit facilities, refinance indebtedness, and for acquisition purposes.

Bond Issuer

Xiaomi Best Time International Limited

Guarantor

Xiaomi Corporation

Announcement Date

07 Jul 2021

Issue Date

14 Jul 2021

Maturity Date

14 Jul 2031

Years to Maturity / Next Call

4.770 / 4.521

Modified Duration

4.313 @ 06 Oct 2026

Issue / Reoffer Price

99.141

Issue / Reoffer Yield

2.975

Coupon Type

Fixed

Annual Coupon Rate

2.875

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

-

ISIN

USY77108AD33

CUSIP

BQ4045879

Bond Currency

USD

Total Issue Size

800,000,000

Min. Investment Quantity (Nominal)

USD 200,000

Incremental Quantity (Nominal)

USD 1,000

Bond Type

Corporate

Bond Sector

Information Technology

Bond Sub Sector

Communications Equipment

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ BBB+

Shariah Compliant

No

Exchange Listed

HKEX

Bond Feature(s)
Issuer Call
The Issuer may, at any time upon giving not less than 30 nor more than 60 days’ written notice to holders of the Bonds, redeem the Bonds at any time on or after April 14, 2031, in whole or in part, at a redemption price equal to 100% of the principal amount of the Bonds to be redeemed plus accrued and unpaid interest, if any, to (but not including) the date of redemption; provided that the principal amount of a Bond remaining outstanding after redemption in part shall be US$200,000 or integral multiples of US$1,000 in excess thereof.
Make Whole Call
The Issuer may, at the Issuer’s or the Guarantor’s option, at any time upon giving not less than 30 nor more than 60 days’ written notice to holders of the Bonds (which notice shall be irrevocable), redeem the Bonds prior to Apil 14, 2031, in whole or in part, at a redemption amount equal to the greater of:

• 100% of the principal amount of the Bonds to be redeemed; and

• the make-whole amount, which means the amount determined on the fifth Business Day before the redemption date equal to the sum of (i) the present value of the principal amount of the Bonds to be redeemed, assuming a scheduled repayment thereof on the stated maturity date, plus (ii) the present value of the remaining scheduled payments of interest to and including the stated maturity date, in each case discounted to the redemption date on a semi-annual basis (assuming a 360-day year consisting of twelve 30-day months and, in the case of an incomplete month, the actual number of days elapsed) at the Treasury Yield plus 25 basis points,

plus, in each case, accrued and unpaid interest on the Bonds to be redeemed, if any, to, but not including, the redemption date; provided that the principal amount of a Bond remaining outstanding after redemption in part shall be US$200,000 or an integral multiple of US$1,000 in excess thereof. For the avoidance of doubt, neither the Trustee nor the Agents shall be responsible for calculating the make-whole amount.
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