HKLSP 3.450% 03Dec2039 Corp (SGD)

Bond Information

The Hongkong Land Treasury Services (Singapore) Pte. Ltd. operates as a special purpose entity. The Company was formed for the purpose of issuing debt securities to repay existing credit facilities, refinance indebtedness, and for acquisition purposes.

Bond Issuer

The Hongkong Land Treasury Services (Singapore) Pte. Ltd.

Guarantor

The Hongkong Land Company Limited

Announcement Date

21 Nov 2019

Issue Date

03 Dec 2019

Maturity Date

03 Dec 2039

Years to Maturity / Next Call

13.168 / -

Modified Duration

10.363 @ 02 Oct 2026

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.450

Coupon Type

Fixed

Annual Coupon Rate

3.450

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

XS2086481285

CUSIP

ZQ7311587

Bond Currency

SGD

Total Issue Size

150,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Financials

Bond Sub Sector

Real Estate Management and Development

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

Coupon Dates	Coupon Receive	Principal Amount	Cash Flow

No Data