Equinix Asia Financing Corporation Pte. Ltd.
Indicative
Full Lot
Indicative price as of 06 Oct 2026, 4:04pm
Ask Yield to Worst
Bid Yield to Worst
Ask Yield to Maturity
Bid Yield to Maturity
Bond Issuer
Equinix Asia Financing Corporation Pte. Ltd.
Guarantor
Equinix Inc.
Announcement Date
06 Mar 2025
Issue Date
13 Mar 2025
Maturity Date
15 Mar 2030
Years to Maturity / Next Call
3.439 / 3.362
Modified Duration
3.208 @ 06 Oct 2026
Issue / Reoffer Price
100.000
Issue / Reoffer Yield
3.500
Coupon Type
Fixed
Annual Coupon Rate
3.500
Coupon Frequency
Semi Annually
Seniority
Senior Unsecured
Reference Rate
-
ISIN
SGXF23573201
CUSIP
YQ1395223
Bond Currency
SGD
Total Issue Size
500,000,000
Min. Investment Quantity (Nominal)
SGD 250,000
Incremental Quantity (Nominal)
SGD 250,000
Bond Type
Corporate
Bond Sector
Financials
Bond Sub Sector
Real Estate Investment Trusts
Issuer Credit Rating (S&P/ Fitch)
***/ N.R
Bond Credit Rating (S&P/ Fitch)
***/ BBB+
Shariah Compliant
No
Exchange Listed
SGX
Par Call:1 month
The “Make-Whole Redemption Price” means an amount equal to the greater of:
(a) (i) the sum of the present values of the remaining scheduled payments of principal and interest thereon discounted to the Make-Whole Redemption Date (assuming the Notes matured on the Par Call Date), less (ii) interest accrued to the Make-Whole Redemption Date; and
(b) 100 per cent. of the outstanding Aggregate Nominal Amount of Notes to be redeemed,
plus, in either case, accrued and unpaid interest thereon to, but excluding, the Make-Whole Redemption Date.
Par Call:1 month
Cash Flow Information