Bond Factsheet
Bond Factsheet

SCISP 3.650% 23Oct2036 Corp (SGD)

Sembcorp Financial Services Pte. Ltd.

Indicative

Full Lot

Bid Price
102.750
Change in Bid Price
0.125
Bid Yield (%)
3.326 %
Change in Bid Yield
remove 0.014
Ask Price
103.600
Change in Ask Price
0.125
Ask Yield (%)
3.227 %
Change in Ask Yield
remove 0.015

Indicative price as of 02 Oct 2026, 4:33pm

Created with Highcharts 10.3.3Yield (%)Chart context menuYield1 Sep3 Sep5 Sep7 Sep9 Sep11 Sep13 Sep15 Sep17 Sep19 Sep21 Sep23 Sep25 Sep27 Sep29 Sep1 Oct2.933.13.23.33.4

Ask Yield to Maturity

Bid Yield to Maturity


Bond InformationSembcorp Financial Services Pte. Ltd. operates as an energy transition company. The Company specializes in developing renewable energy such as solar, wind, and energy storage systems through decarbonization, water, and waste resource management for clean energy infrastructure solutions. Sembcorp Financial Services serves customers worldwide.

Bond Issuer

Sembcorp Financial Services Pte. Ltd.

Guarantor

Sembcorp Industries Ltd

Announcement Date

16 Oct 2024

Issue Date

23 Oct 2024

Maturity Date

23 Oct 2036

Years to Maturity / Next Call

10.063 / -

Modified Duration

8.264 @ 02 Oct 2026

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.650

Coupon Type

Fixed

Annual Coupon Rate

3.650

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

-

ISIN

SGXF60713694

CUSIP

YU5591166

Bond Currency

SGD

Total Issue Size

350,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Financials

Bond Sub Sector

Diversified Financial Services

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

No

Exchange Listed

SGX

Bond Feature(s)
Not Available
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Maturity Date: 23 Oct 2036

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