Daewoo Engineering & Construction Co., Ltd.
Indicative
Full Lot
Indicative price as of 02 Oct 2026, 4:33pm
Bond Issuer
Daewoo Engineering & Construction Co., Ltd.
Guarantor
Credit Guarantee & Investment Facility
Announcement Date
26 Feb 2024
Issue Date
05 Mar 2024
Maturity Date
05 Mar 2029
Years to Maturity / Next Call
2.416 / -
Modified Duration
2.296 @ 02 Oct 2026
Issue / Reoffer Price
100.000
Issue / Reoffer Yield
3.880
Coupon Type
Fixed
Annual Coupon Rate
3.880
Coupon Frequency
Semi Annually
Seniority
Senior Unsecured
Reference Rate
-
ISIN
SGXF36545618
CUSIP
ZD3084807
Bond Currency
SGD
Total Issue Size
150,000,000
Min. Investment Quantity (Nominal)
SGD 250,000
Incremental Quantity (Nominal)
SGD 250,000
Bond Type
Corporate
Bond Sector
Industrials
Bond Sub Sector
Construction and Engineering
Issuer Credit Rating (S&P/ Fitch)
***/ N.R
Bond Credit Rating (S&P/ Fitch)
***/ N.R
Shariah Compliant
No
Exchange Listed
SGX
At any time following the occurrence of a CGIF Acceleration (as defined herein and in the Conditions), the Guarantor may at its discretion, on giving not less than seven (7) nor more than fifteen (15) days’ notice to the Issuer, the Trustee and the Paying Agent require the Issuer to redeem the Bonds in whole, but not in part only, at their principal amount, together with interest accrued but unpaid to the date fixed for redemption following which the Issuer shall immediately, or if the Issuer fails to do so the Guarantor may, give notice to the Bondholders, the Trustee and the Paying Agent in accordance with Condition 16 (Notices) (which notice shall be irrevocable).
Cash Flow Information