Chip Eng Seng Corp Ltd
Indicative
Full Lot
Indicative price as of 19 May 2022, 12:00am
Bond Issuer
Chip Eng Seng Corp Ltd
Guarantor
-
Announcement Date
09 May 2017
Issue Date
19 May 2017
Maturity Date
19 May 2022
Years to Maturity / Next Call
- / -
Modified Duration
-
Issue / Reoffer Price
100.000
Issue / Reoffer Yield
4.900
Coupon Type
Fixed
Annual Coupon Rate
4.900
Coupon Frequency
Semi Annually
Seniority
Senior Unsecured
Reference Rate
-
ISIN
SG7BC0000007
CUSIP
AN5343404
Bond Currency
SGD
Total Issue Size
125,000,000
Outstanding Issue Size
15,000,000
Min. Investment Quantity (Nominal)
SGD 250,000
Incremental Quantity (Nominal)
SGD 250,000
Bond Type
High Yield Corporate
Bond Sector
Financials
Bond Sub Sector
Real Estate Management and Development
Issuer Credit Rating (S&P/ Fitch)
***/ N.R
Bond Credit Rating (S&P/ Fitch)
***/ N.R
Shariah Compliant
No
Exchange Listed
SGX
For the purposes of this Condition 6(e)(ii):
(1) a "Change of Control" means (1) a change in shareholding of the Issuer on any date which results in Lim Tiam Seng, Lim Tiang Chuan, Lim Tian Back, Lim Tian Moh, Kwek Lee Keow, Lim Sock Joo, Chia Lee Meng Raymond, Lim Ling Kwee, Dawn Lim Sock Kiang and Hoang Vu Ha and their respective Immediate Family Members (together, the "Founder Group") ceasing to collectively own in aggregate direct or deemed interest of at least 25 per cent. of the issued share capital for the time being of the Issuer, and/or (2) any person or persons acting in concert (other than any member of the Founder Group) acquiring ownership of direct or deemed interest of 30 per cent. or more in aggregate of the issued share capital for the time being of the Issuer; and
(2) "Immediate Family Members" means, in respect of a person, the spouse, parents, children and siblings of such person.
