LENOVO 3.875% 16Mar2022 Corp (USD)

Bond Factsheet

Matured/ Called

Lenovo Group Limited

Indicative

Full Lot

Bid Price

100.000

Change in Bid Price

Bid Yield (%)

Change in Bid Yield

Ask Price

100.250

Change in Ask Price

Ask Yield (%)

Change in Ask Yield

Indicative price as of 16 Feb 2023, 12:00am

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Bond Information

Lenovo Group Limited develops, manufactures, and distributes intelligent devices. The Company provides laptops, desktops, tablet PCs, accessories, and data center equipment such as servers and storage, as well as offers infrastructure solutions and software services. Lenovo Group serves customers worldwide.

Bond Issuer

Lenovo Group Limited

Guarantor

Announcement Date

09 Mar 2017

Issue Date

16 Mar 2017

Maturity Date

16 Mar 2022

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

99.806

Issue / Reoffer Yield

3.918

Coupon Type

Fixed

Annual Coupon Rate

3.875

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

XS1573181440

CUSIP

AM8001464

Bond Currency

USD

Total Issue Size

Outstanding Issue Size

337,309,000

Min. Investment Quantity (Nominal)

USD 200,000

Incremental Quantity (Nominal)

USD 1,000

Bond Type

Corporate

Bond Sector

Information Technology

Bond Sub Sector

Technology Hardware, Storage and Peripherals

Issuer Credit Rating (S&P/ Fitch)

***/ BBB

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

HKEX

Bond Feature(s)

Not Available

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