SIASP 3.000% 20Jul2026 Corp (USD)

Bond Factsheet

Matured/ Called

Singapore Airlines Limited

Indicative

Full Lot

Bid Price

100.029

Change in Bid Price

0.005

Bid Yield (%)

Change in Bid Yield

Ask Price

100.032

Change in Ask Price

0.005

Ask Yield (%)

Change in Ask Yield

Indicative price as of 20 Jul 2026, 12:00am

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Bond Information

Singapore Airlines Limited provides air transportation, engineering, pilot training, air charter, and tour wholesaling services. The Company's airline operation covers Asia, Europe, the Americas, South West Pacific, and Africa.

Bond Issuer

Singapore Airlines Limited

Guarantor

Announcement Date

13 Jan 2021

Issue Date

20 Jan 2021

Maturity Date

20 Jul 2026

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

99.573

Issue / Reoffer Yield

3.085

Coupon Type

Fixed

Annual Coupon Rate

3.000

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

XS2284332769

CUSIP

BN5063639

Bond Currency

USD

Total Issue Size

500,000,000

Min. Investment Quantity (Nominal)

USD 200,000

Incremental Quantity (Nominal)

USD 1,000

Bond Type

Corporate

Bond Sector

Industrials

Bond Sub Sector

Airlines

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

SGX

Bond Feature(s)

Issuer Call

At any time on or after 20 June 2026 (being the date falling one (1) month prior to the Maturity Date) at the Redemption Amount.

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