HLPPY 2.280% 05Feb2027 Corp (HKD)

Bond Factsheet

HLP Finance Limited

Indicative

Full Lot

Bid Price

99.386

Change in Bid Price

0.016

Bid Yield (%)

4.142 %

Change in Bid Yield

remove 0.033

Ask Price

99.705

Change in Ask Price

0.017

Ask Yield (%)

3.167 %

Change in Ask Yield

remove 0.044

Indicative price as of 02 Oct 2026, 4:36pm

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Bond Information

HLP Finance Limited operates as a real estate development company. The Company develops residential areas, office buildings, and real estate projects.

Bond Issuer

HLP Finance Limited

Guarantor

Hang Lung Properties Ltd

Announcement Date

22 Jan 2021

Issue Date

05 Feb 2021

Maturity Date

05 Feb 2027

Years to Maturity / Next Call

0.343 / -

Modified Duration

0.325 @ 02 Oct 2026

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

2.280

Coupon Type

Fixed

Annual Coupon Rate

2.280

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

XS2293544347

CUSIP

BN6963217

Bond Currency

HKD

Total Issue Size

750,000,000

Min. Investment Quantity (Nominal)

HKD 1,000,000

Incremental Quantity (Nominal)

HKD 1,000,000

Bond Type

High Yield Corporate

Bond Sector

Financials

Bond Sub Sector

Real Estate Management and Development

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

HKEX

Bond Feature(s)

Not Available

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Coupon Dates	Coupon Receive	Principal Amount	Cash Flow

No Data