KEPSP 3.000% 07May2024 Corp (SGD)

Bond Factsheet

Matured/ Called

Keppel Limited

Indicative

Full Lot

Bid Price

99.966

Change in Bid Price

0.004

Bid Yield (%)

Change in Bid Yield

Ask Price

100.041

Change in Ask Price

0.006

Ask Yield (%)

Change in Ask Yield

Indicative price as of 07 May 2024, 12:00am

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Bond Information

Keppel Limited is an asset manager and operator. The Company focuses on sustainability solutions spanning the areas of energy and environment, urban development, and digital connectivity, as well as provides critical infrastructure and services through its investment platforms and asset portfolios. Keppel serves clients worldwide.

Bond Issuer

Keppel Limited

Guarantor

Announcement Date

29 Apr 2019

Issue Date

07 May 2019

Maturity Date

07 May 2024

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.000

Coupon Type

Fixed

Annual Coupon Rate

3.000

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SGXF73155974

CUSIP

ZS3816049

Bond Currency

SGD

Total Issue Size

150,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Industrials

Bond Sub Sector

Industrial Conglomerates

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

SGX

Bond Feature(s)

Not Available

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