KEPSP 3.660% 07May2029 Corp (SGD)

Bond Information

Keppel Limited is an asset manager and operator. The Company focuses on sustainability solutions spanning the areas of energy and environment, urban development, and digital connectivity, as well as provides critical infrastructure and services through its investment platforms and asset portfolios. Keppel serves clients worldwide.

Bond Issuer

Keppel Limited

Guarantor

Announcement Date

29 Apr 2019

Issue Date

07 May 2019

Maturity Date

07 May 2029

Years to Maturity / Next Call

2.590 / -

Modified Duration

2.425 @ 02 Oct 2026

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

3.660

Coupon Type

Fixed

Annual Coupon Rate

3.660

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SGXF55503175

CUSIP

ZS3816676

Bond Currency

SGD

Total Issue Size

350,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Industrials

Bond Sub Sector

Industrial Conglomerates

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

SGX

Coupon Dates	Coupon Receive	Principal Amount	Cash Flow

No Data