STSP 2.895% 07Mar2023 Corp (SGD)

Bond Factsheet

Matured/ Called

SingTel Group Treasury Pte Ltd

Indicative

Full Lot

Bid Price

99.950

Change in Bid Price

Bid Yield (%)

Change in Bid Yield

Ask Price

100.000

Change in Ask Price

Ask Yield (%)

Change in Ask Yield

Indicative price as of 21 Mar 2023, 12:00am

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Bond Information

Singtel Group Treasury Pte. Ltd. provides telecommunication services.

Bond Issuer

SingTel Group Treasury Pte Ltd

Guarantor

Singapore Telecommunications Ltd

Announcement Date

29 Feb 2016

Issue Date

07 Mar 2016

Maturity Date

07 Mar 2023

Years to Maturity / Next Call

- / -

Modified Duration

Issue / Reoffer Price

100.000

Issue / Reoffer Yield

2.895

Coupon Type

Fixed

Annual Coupon Rate

2.895

Coupon Frequency

Semi Annually

Seniority

Senior Unsecured

Reference Rate

ISIN

SG71D5000006

CUSIP

JK2877807

Bond Currency

SGD

Total Issue Size

250,000,000

Min. Investment Quantity (Nominal)

SGD 250,000

Incremental Quantity (Nominal)

SGD 250,000

Bond Type

Corporate

Bond Sector

Telecommunication Services

Bond Sub Sector

Wireless Telecommunication Services

Issuer Credit Rating (S&P/ Fitch)

***/ N.R

Bond Credit Rating (S&P/ Fitch)

***/ N.R

Shariah Compliant

Exchange Listed

Bond Feature(s)

Not Available

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